Sell 【spot goods】◑（shoppingDiarys） CPU SMT BGA Reballing Adhesive Solder Flux Paste for Phone IC Chips Re best price

Features: Good wettability and dry resistance. Solder paste is usually refrigerated at a temperature of 0 ~ 10 ℃. Strong welding ability, high resistance, strong activity, no false or false welding. Suitable for mobile phone maintenance industry, SMT welding of high precision circuit board, BGA process welding. Shielding barrier value tin, CPU value tin, etc. Specifications: Material: plastic shell Size: 37 * 37 * 20mm/1.46*1.46*0.79" Melting point: 183 ° Notes: 1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you! 2. Please allow 1-3cm measuring deviation due to manual measurement. Included: 1 XSolder Flux Paste