Sell Relife 10Cc Rl-403 Bga Tin Solder Paste No-Clean Leaded Sn63/Pb37 Syringe Liquid Flux Melting Point best price

Syringe 10CC RL-403 High quality Solder Paste Flux, RELIFE RL-403 Soldering Paste Tin Sn63/Pb37 20-38um For Phone motherboard BGA soldering repair. Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy moldingSyringe 10CC RL-403 Solder Paste Flux 183℃ no-clean Phone Repair solderingSpecification:Name: RELIFE RL-403 183℃ solder paste (syringe)Specifications: 10ccAlloy: Sn63/Pb37Microns: 20-38umFeature:1.Good adhesion. Paste delicate, particles small, only 20~38 microns.2.Excellent wettability.After opening, the surface remains moist for 36 hours. Does not affect the welding.3.Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy moldingApplication: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ /forming fast and easy to weld conductive. No.SMT-4000592549373 #Mobile & Gadgets #Others #Others