Sell 【Ready Stock】♗⊙High Quality NC-559-ASM 100G Solder Flux Paste for SMT BGA Reballing Repair Paste G8P best price
0
ratings
₱607 - ₱615
| Ships from | Ermita, Metro Manila |
|---|---|
| Variation | RMA-223-UV NC-559-ASM |
| Size | as shown |
Product Description
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
el: NC-559-ASM/RMA-223-UV
Volume: 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
colour: light green
Material: solder paste
size: 73.7x58.4mm
Package Contents:
1 x Flux<br />Only the above package content, other products are not included.<br />Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
