Sell Intel Core i3-10100F i3 10100F 3.6 GHz 4-core 8-thread CPU processor L2 = 1M L3 = 6m 65W LGA 1200 ne best price

Intel Core i3-10100F specifications The specs can be used for short-term listings on auction and classifieds sites General information Type CPU / Microprocessor Market segment Desktop Family Intel Core i3 Model number ? i3-10100F CPU part numbers CM8070104291318 is an OEM/tray microprocessor BX8070110100F is a boxed processor (English version) BXC8070110100F is a boxed processor (Chinese version) Frequency ? 3600 MHz Maximum turbo frequency 4300 MHz (1 core) Low power frequency 800 MHz Bus speed ? 8 GT/s DMI Clock multiplier ? 36 Package 1200-land Flip-Chip Land Grid Array Socket Socket 1200 Size 1.48" x 1.48" / 3.75cm x 3.75cm Introduction date 4th quarter 2020 S-spec numbers Part number Production processors SRH8U BX8070110100F + BXC8070110100F + CM8070104291318 + Architecture / Microarchitecture Microarchitecture Comet Lake Processor core ? Comet Lake-S Core stepping ? G1 (SRH8U) CPUID A0653 (SRH8U) Manufacturing process 0.014 micron Data width 64 bit The number of CPU cores 4 The number of threads 8 Floating Point Unit Integrated Level 1 cache size ? 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches Level 2 cache size ? 4 x 256 KB 4-way set associative caches Level 3 cache size 6 MB shared cache Physical memory 128 GB Multiprocessing Uniprocessor Extensions and Technologies MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ? AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions AVX2 / Advanced Vector Extensions 2.0 BMI / BMI1 + BMI2 / Bit Manipulation instructions F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions EM64T / Extended Memory 64 technology / Intel 64 ? HT / Hyper-Threading technology ? VT-x / Virtualization technology ? VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0 ? Security Features NX / XD / Execute disable bit ? SGX / Software Guard Extensions Low power features Core C1/C1E, C3, C6, C7, C8, C9 and C10 states Package C3, C6, C7, C8, C9 and C10 states Enhanced SpeedStep technology ? Integrated peripherals / components Integrated graphics None Memory controller The number of controllers: 1 Memory channels: 2 Supported memory: DDR4-2666 Maximum memory bandwidth (GB/s): 42.7 Other peripherals Direct Media Interface 3.0 (4 lanes) PCI Express 3.0 interface (16 lanes) Electrical / Thermal parameters Maximum operating temperature ? 100°C (junction) Thermal Design Power ? 65 Watt Notes on I